Alpha’s Corné Hoppenbrouwers to Present at the 5th EPP Innovations Forum in Germany
Somerset, NJ – February 14th, 2016
Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will present its latest high reliability products and solutions for the solder paste printing process at the 5th EPP Innovations Forum on Thursday 9th March, in Böblingen, Germany.
Alpha’s presentation, which will be given by Corné Hoppenbrouwers, Technical Support Manager for Central Europe, will focus on how to achieve a successful and repeatable solder paste printing result by combining the correct stencil, aperture design, squeegee and solder paste.
“As the electronics industry demands higher reliability, the pressure on equipment manufacturers to eliminate defects has increased significantly. In response to this, Alpha’s innovative stencils and solder paste products provide the solution in implementing a ‘Zero Defect Strategy’ to the solder paste printing process”, commented Corné Hoppenbrouwers.
Alpha’s range of stencil products including ALPHA® Cut Stencils are designed to provide the ultimate printing performance. ALPHA® Cut Laser Cut Stencils are manufactured using a CAD/CAM driven high precision XY-Laser cutting process. The apertures generated through this technique give trapezoidal geometry which provides superb positional accuracy, aperture tolerance and ultra-fine pitch repeatability. This, combined with Alpha’s range of advanced solder pastes, maximizes printing results and reduces defects.
The 5th EPP Innovations Forum in Germany will focus on the Zero Defect Strategy and will look at how quality starts with design before going through the complete value chain, from stencil printing to assembly and soldering up to the actual inspection or test. The event will bring together a number of key industry professionals who will each give a 20-minute talk. There will also be breaks throughout the day for networking opportunities.
To register for the event please go to: