Alpha to Feature New Solder Paste & Preform Innovations for Low Voiding at IPC APEX
Somerset, NJ – January 18th, 2017
Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will introduce several new product innovations at the upcoming IPC APEX Expo in San Diego that will soon be coming to market.
Alpha, a part of the MacDermid Performance Solutions group of businesses, will feature ALPHA® OM-358, the next generation high-reliability Innolot solder paste with ultra-low voiding properties ideal for automotive applications, at the Alpha Booth, #2901. ALPHA® Accuflux™ Preforms, designed specifically for large area power components that require consistent low-voiding solder joints from normal SMT processes, will also be highlighted.
“Voiding is a critical reliability issue that one can help mitigate by choosing the right soldering materials for your process or application,” said Robert Wallace, Regional Marketing Manager for the Americas. “ALPHA® OM-358 is ideal for OEM’s using high reliability alloys, alloys that historically have produced a larger amount of voids than the SAC family of standard alloys, to reduce the level of voids in the joints close to those achieved in SAC305 while using Innolot/MAXREL™/MAXREL™ Plus alloys and benefitting from all the mechanical properties of these high reliability alloys.” He continues, “Accuflux™ Preforms also contain an ultra-low voiding flux formulation that is deposited very accurately from preform to preform ensuring repeatable performance every time. They are available in Tape & Reel for easy assembly in SMT reflow applications.”
Also coming soon to market are ALPHA® OM-347 Solder Paste, a cleanable, no-clean material with fine feature printing capabilities that is derived from the SAC family of alloys and ALPHA® Powerbond Preform Alloys specifically designed for power module assemblies. Powerbond provides higher tensile strength than traditional SAC alloys and thermal fatigue properties moving closer to that of high-lead.