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Alpha to Present Technical Papers at SMTA International Conference on Soldering and Reliability in Markham, Ontario, Canada

Contacts
ason Fullerton
Jason.Fullerton@alphaassembly.com

Karen Tellefsen
Karen.Tellefsen@alphaassembly.com

Alpha to Present Technical Papers at SMTA International Conference on Soldering and Reliability in Markham, Ontario, Canada

Somerset, NJ – May 9th, 2017

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will present two papers at the SMTA International Conference on Soldering and Reliability (ICSR) being held in Markham, Ontario, June 6 – 8, 2017.

Jason Fullerton, Customer Technical Support (CTS) Engineer at Alpha, will present his paper, “A Comparison of Localized Electronics Cleanliness Testing and Surface Insulation Resistance – Part 1”. This paper is Fullerton’s investigation and comparison of six no-clean liquid wave soldering fluxes and their performance using a Critical Cleanliness Control (C3) cleanliness tester and Surface Insulation Resistance (SIR) testing.

Karen Tellefsen, Senior Research Chemist at Alpha, will deliver her paper, “The Effect of FR-4 Laminate Materials on the Surface Insulation Resistance of Wave Soldering Fluxes”, a detailed analysis of how different laminate chemistry impacts surface insulation resistance (SIR) results since the implementation of Pb-free processing.

Both papers will be delivered as part of Session 4: Contamination and Cleanliness Testing being held on Wednesday, June 7 from 3:30 pm – 4:30 pm.

Alpha, a part of the MacDermid Performance Solutions group of businesses, will also be exhibiting at the Expo & Tech Forum being held in conjunction with the Conference on June 7. Alpha will showcase its portfolio of innovative materials and solutions for the electronics assembly industry and its ALPHA® Recycling Services capabilities.

About SMTA
The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

 
  
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