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Alpha to Present on Sintering Technology at the Exhibitor Forum at PCIM, Nuremberg 2017

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Julien Joguet
Julien.Joguet@alphaassembly.com

Alpha to Present on Sintering Technology at the Exhibitor Forum at PCIM, Nuremberg 2017

Somerset, NJ – May 2nd, 2017

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will present a paper titled ‘Double Side Sintered Diode + IGBT 650V/200A in a STO247 Package for High Performance Automotive Applications’ at the PCIM Exhibition, Nuremberg, Germany on Tuesday the 16th of May.

The paper, to be presented by Julien Joguet, Global Product Manager for Sintered Materials for Alpha, a part of the MacDermid Performance Solutions group of businesses, will discuss the findings of a study which tested a double side sintered STO247 type packaged device that had been fully sintered using ALPHA® Argomax® against the leading device on the market used in high performance electric cars.

The reliability requirements for packaged devices are becoming more severe given the significantly higher power density levels in these applications that devices are subjected to over their operating life. Several new device technologies are emerging in the market to address the performance and reliability requirements.

“These technologies will be limited if advances in attachment methods do not evolve as well”, said Julien Joguet. “The ALPHA® Argomax® silver sintering paste and film technologies for die attachment allow a fast, low-pressure process for a wide range of applications including Power, RF, and high power LEDS. This allows for high thermal and electrical conductivity silver bonds and flexible bondline thickness – both which address issues with die attach reliability in high volume manufacturing processes.”

To see the conclusions of this study, please visit the Exhibitor Forum at PCIM on Tuesday 16th May at 10.20am or visit us in Hall 7 Booth# 518.

PCIM
Date: May 16-18, 2017
Venue: Exhibition Centre, Nuremberg
Mesago.de/PCIM/Welcome

 
  
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