MacDermid Alpha‘s Assembly Division to Present Latest Silver Sinter Technology at ECPE Workshop

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MacDermid Alpha‘s Assembly Division to Present Latest Silver Sinter Technology at ECPE Workshop

(Waterbury, CT USA) – Oct 3rd, 2019 – The Assembly division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will be presenting on the latest developments in silver sintering at the upcoming Advanced Power Packaging – Power Modules 2.0 Workshop hosted by the European Center for Power Electronics (ECPE) from the 9th-10th October in Hamburg, Germany.

Michiel de Monchy, Customer Technical Support Manager for ALPHA® Argomax® and Die Attach Products at MacDermid Alpha, will be presenting `Silver Sintering – New Form Factors for Next Generation Power Modules‘, during the Die Attach session at the workshops. ¨Higher performance, efficiency and reliability of power modules is increasingly demanded by the power semiconductor industry¨, comments Michiel. ¨To help meet and exceed these demands ALPHA® Argomax® Silver Sinter products create extremely high thermal and electrical conductivity silver bonds that deliver flexible bondline thickness as well as high reliability and high efficiency for cost effective, high volume manufacturing processes.¨

The ECPE Workshop will also include presentations on a number of topics concerning Advanced Power Packaging including System Integration, Top Die Connection, High Voltage Applications, Encapsulation and Cooling.

Michiel’s presentation will take place at 12:30pm on Wednesday 9th October. To view the agenda and register for the event please vist the ECPE website. For more information on ALPHA® Argomax® Silver Sinter Technology visit MacDermidAlpha.com 

About MacDermid Alpha Electronics Solutions

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection.  We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain.  The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.

Contact:

Name: Michiel de Monchy

Title: Customer Technical Support Manager Argomax® & Die Attach

Email: Michiel.deMonchy@MacDermidAlpha.com

 
  
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