ALPHA® Argomax®

For LED Applications

Argomax® film technology was specifically designed for low-pressure sintering die attachment, based on highly engineered particles manufactured by Alpha. ALPHA® Argomax® film enables ultra high reliability, high-volume manufacturing processes for high-brightness, high-power LEDs. It provides high thermal and electrical conductivity silver bonds, with controlled bond line thickness.

Features and Benefits
  • Pure Silver bond line for high reliability and performance
  • Film format for ease of use in manufacturing
  • High thermal and electrical conductivity
  • Low sintering pressure for high yield manufacturing
  • No fillet or bleed out, enabling placement of dies closer together

 

Argomax® 8021L

Application Platform

Film – Die Transfer Film (DTF)

Sintering Temp

230-300°C

Thermal Conductivity

>200-250W/mK

Substrate

DBC, Cu Leadframe, AIN, Cu MCPCB

Surface Finish Compatibility

Ag, Au

“Chip Structure “Recommendation”

Vertical Chip in Package / Large Single Die

 
  
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