P53 is a low temperature solder paste technology designed to enable a LED package-on-flex reflow application, especially for PET flexible substrates. ALPHA®
P53 solder paste version with ALPHA®
SBX02 alloy, melting point below 140oC, has been successfully used with peak reflow profiles between 155oC and 190oC. ALPHA®
SBX02 alloy has improved Mechanical Strength and Drop Shock Resistance than the SnBi0.4Ag alloy. The flux residue from ALPHA®
P53 provides excellent electrical resistivity, exceeding industry standards.