ALPHA EF-3215, is a resin/rosin containing, low-VOC, low solids, no-clean flux which provides the highest activity of any low-VOC for defect-free soldering. It is formulated with a proprietary mixture of resin/rosin and organic activators. ALPHA EF-3215 delivers excellent wetting and topside hole fill, even with OSP coated bare copper boards and superior reliability. Several proprietary additives are also formulated into ALPHA EF-3215, which act to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solderball generation. The formulation of ALPHA EF-3215 is also designed to be more thermally stable; thereby, reducing the occurrence of solder bridging.