ALPHA® SLS-65C was specifically developed to eliminate the tendency for solder balling and solder bridging-two defects which are normally associated with the use of the chip wave. Of all low solids (< 4% solids), no-clean fluxes, SLS-65C exhibits the lowest tendency for solder ball generation over a wide variety of solder masks. SLS-65C should be considered for use by any assembler who has board designs which are sensitive to solder bridging, performs pin testing, and whose specification requires an extremely low frequency of solder balls.
ALPHA SLS-65C is an active, low solids, no-clean flux. It is formulated with a proprietary mixture of organic activators. Several proprietary additives are formulated into SLS-65C which act to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solder ball generation. The formulation of SLS-65C is also designed to be more thermally stable; thereby, reducing the occurrence of solder bridging.