ALPHA® Argomax® 8031 Film

Product Overview

ALPHA Argomax 8031 Film is a low-pressure silver sintering die attach film from Alpha. It is specially designed for application at wafer level and is particularly suited for high volume die attach of power discrete on leadframes.

Processing (lamination, dicing, pick-up) of ALPHA Argomax 8031 may vary based on die size, wafer thickness and type, etc.

Product Features

Designed specifically for wafer dicing after lamination with dicing tape
Formulated for Ag/Au surface die attach
Film can be cut to custom sizes
Pure silver bond line for high performance and reliability
High thermal and electrical conductivity
Low sintering pressure for high yield manufacturing
Die attach temperatures suitable for semiconductor manufacturing

Wafer Level Sintering Die Attach Film

ALPHA Argomax 8031 Film is a low-pressure silver sintering die attach film that is specially designed for application at wafer level and is particularly suited for high volume die attach of power discrete on leadframes.

After lamination on the wafer back-side, the film can be diced in a regular saw dicing machine. The diced laminated dies can be picked / placed using standard die bonders (including epoxy, soft solder). The sintering of the placed dies can be accomplished using low temperatures and pressures due to our proprietary silver particles

After sintering, ALPHA Argomax 8031 film produces a high purity, high thermal and electrical conductivity diffusion bond between the die and substrate.

Related Products

Product Type	Product Name	Compatible Surface Finish	Product Application Method	End Application
Sinter Film	ALPHA Argomax 8035 Film	Cu	Wafer Lamination	Wafer Lamination
Sinter Paste	ALPHA Argomax 2010C Paste	Ag, Au	Print	Die Attach, Die Top Attach
Sinter Paste	ALPHA Argomax 2040 Paste	Ag, Au	Print, Dot Dispense	Die Attach, Die Top Attach
Engineered Sinter Product	ALPHA Argomax 6500 Bond Pad	Ag, Au, Cu	Pick & Place	Die Top Attach
Engineered Sinter Product	ALPHA Argomax 9200 Preform	Ag, Au	Pick & Place	Die Top Attach, Package/Module Attach, Substrate Attach, Spacer Attach

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