ALPHA® Argomax® 8030 Film

For High Volume Manufacturing of Automatic Wafer Lamination & Dicing

Argomax® 8030 film from Alpha is specifically developed for die attachment using rapid low pressure sintering process designed for high volume manufacturing. Argomax® 8030 film is designed to be laminated on the back side of the wafer which then is diced using standard dicing equipment. Alpha manufactures highly engineered silver particles for use in Argomax® 8030 films.

Argomax® 8030 film produces high thermal and electrical conductivity silver bond between various components that make up your device, providing good adhesion and flexible bond line thickness.  Alpha can provide you with a custom designed film to produce bondlines typically from 5 to 20 µm or larger, which is an excellent choice for many large components.

Watch our video on Direct Sintering:

 


 

With ALPHA® Argomax® 8030/8035 laminated to your wafer, you will have a ready solution to meet your high volume manufacturing needs.

Features and Benefits

  • Pure Silver bond line for high reliability and performance
  • Film format for ease of use in manufacturing
  • Easy and reliable lamination 
  • Long shelf life at room temperature
  • High thermal and electrical conductivity
  • Low sintering pressure for high yield manufacturing
  • Die attach temperatures suitable for semiconductor packaging

 

Argomax® 8030

Application

Film – Wafer Level Processing

Sintering Temperature

200-300°C

Thermal Conductivity

200-300W/mK

Common substrates

DBC

Surface Finish Compatibility

Ag , Au

 
  
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