ALPHA® OM-338-CSP is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338-CSP’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA OM-338-CSP yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability and high “through-put” applications. Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-338-CSP is formulated to deliver excellent visual joint cosmetics. Additionally, ALPHA OM-338-CSP’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.
*Although the appearance of these lead-free alloys will be different to that of tin-lead, with mechanical reliability equal to or greater than with that of tin-lead or tin-lead-silver.