Solder Paste

ALPHA® OM-338-CSP is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338-CSP’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA OM-338-CSP yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability and high “through-put” applications. Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-338-CSP is formulated to deliver excellent visual joint cosmetics. Additionally, ALPHA OM-338-CSP’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.

*Although the appearance of these lead-free alloys will be different to that of tin-lead, with mechanical reliability equal to or greater than with that of tin-lead or tin-lead-silver.

Features & Benefits

  • Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.24mm (0.096”) with 0.100mm (4mil) stencil thickness.
  • Excellent print consistency with high process capability index across all board designs.
  • Print speeds of up to 150mm/sec (6”/sec), enabling a fast print cycle time and a high throughput
  • Wide reflow profile window with good solderability on various board / component finishes.
  • Excellent solder and flux cosmetics after reflow soldering.
  • Reduction in random solderballing levels, minimizing rework and increasing first time yield.
  • Meets highest IPC 7095 voiding performance classification of Class III.
  • Excellent reliability properties, halide-free material.
  • Compatible with either nitrogen or air reflow

Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.

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