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Product Overview
ALPHA OM-5100 Solder Paste is a low residue, no-clean solder paste designed to maximize first pass yields. The ALPHA OM-5100 activation system is optimized to enhance joint solderability and limit post reflow soldering defects.
This paste's wide reflow profile window enables soldering with lead free components. ALPHA OM-5100 is designed for complex assemblies with small (0201) tin finished passives and enables solderability with large (1mm pitch) BGA components containing lead free spheres. Small print deposits remain fully coalesced, even in profiles hot enough to collapse SAC305 BGA spheres.
Features
- Consistent fine-feature print volume repeatability
- Low post reflow residue
- Reduction in Mid chip solder ball defects
- Minimizes random solder balling
Low flux residue volume supports underfill compatibility
Low residue enables high throughput underfill processing. Compatibility with leading underfills offers low underfill voiding and non-delamination to ensure highest mechanical strength of resulting assembly.
Consistent fine feature printability
Superior print volume repeatability down to .300 mm circles and .225mm deposits. ALPHA OM-5100 exhibits excellent print yields with no dog ears or slump on fine feature square deposits.
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