ALPHA® PoP-33

Solder Paste

To meet the demand of high-density and memory/logic options for sophisticated electronic devices, many assemblers are evaluating package on package (PoP) technology. PoP assemblies allow for higher electronic functionality per unit circuit board area, and allows low cost product memory customization, and highly flexible manufacturing. Unlike PoP flux, ALPHA® PoP33 solder paste uses flux and solder powder, to minimize defects associated with non-planar processor/memory combinations during the reflow process. The use of paste can help reduce costly defects associated with soldering known good memory devices to known good processor packages by bridging gaps that PoP flux alone may not.

ALPHA® PoP33 was designed to minimize expensive rework and scrap by providing highly repeatable paste volumes to BGA memory packages. ALPHA® PoP33 maintains its rheology, even under frequent exposure to high shear, for 24 hours. This means highly reproducible volumes of paste pick up in normal PoP dipping applications, reducing defects, increasing yields and reducing scrap. ALPHA® POP33 is a no-clean lead-free solder paste. By optimizing ultra-fine solder powder and physical properties of flux, it is ideal for 150 to 300 μ offset BGA packages, while leaving a clear, colorless, residue with high electrical resistivity.

Product Information

Alloys: SAC305 (96.5%Sn, 3.0%Ag, 0.5%Cu), SAC405 (95.5%Sn, 4.0%Ag, 0.5%Cu)
Powder Size: Type 5 (15-25µm / IPC J-STD-005)
Packaging: 500 g Jar, 10 cc and 30 cc syringes

CATEGORY

RESULT

PROCEDURE/REMARKS

Activity Level

ROL0 = J-STD Classification

IPC J-STD-004

Halide Content

Halide free (by titration & IC).

IPC J-STD-004

 

Halogen Content

Zero halogen,

No halogen intentionally added

PASS

EN-14582-B Oxygen Bomb, IC

IPC J-STD-004

Ag Chromate Test

 

Copper Corrosion Test

PASS

IPC J-STD-004

PASS

JIS Z 3197-1986

Talc Test

PASS

JIS Z 3197

IPC SIR

(7 days @ 40°C/90% RH, 12V)

>1.8 x 108 ohms

PASS, Electrical and Visual requirements

IPC J-STD-004B, IPC-TM-650 (2.6.3.7) (Pass ≥ 1 x 108 ohm min)

Bellcore SIR

(96 hours @ 35°C/85%RH)

9.8 x 1012 ohms

PASS, Electrical and Visual requirements

Bellcore GR78-CORE (Pass ≥ 1 x 1011 ohm min)

 

JIS SIR

(7 days, 100V)

PASS

Initial (Ambient): 1.1 x 1013 ohms After 7 days: 4.9 x 1010 ohms Recovered: 7.2 x 1012 ohms

 

 

JIS-Z-3197-1999

Color

Clear, Colorless Flux Residue

 

 

Viscosity

77.5% metal designated M05

Viscosity (Typical) 500 poise 10 RPM Malcom

Malcom Spiral Viscometer; JIS Z3284 Annex 6

 

Solder ball

Acceptable Tested after 4 hours storage

@ 25%, 50% and 85% RH.

IPC TM-650 2.4.43/JIS Z3284

Annex 11

Stencil Life

> 24 hours

25oC (77°F)

Spread

> 75 %

JIS-Z-3197: 1999 8.3.1.1

Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information. 
 

 
  
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