Features & Benefits
The proprietary Vaculoy process used to produce Vaculoy SMG Bar Solder is a highly effective method for removing included oxides from solder. This is extremely important because included oxides generate excessive drossing and increase the viscosity of the solder. Solder with higher viscostiy can result in increased soldering defects (i.e. solder bridging). In addition, the extremely low oxide levels in Vaculoy ensure strong, clean and well-formed solder joints.
The exceedingly low levels of metallic and non-metallic impurities associated with Vaculoy SMG solder produces the highest quality solder joints while minimizing defect rates. This is due to the superior fluidity of the solder and the elimination of included oxides for greatly reduced drossing and improved wetting characteristics.
Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.