ALPHA® HiTech™ CU13-3150

Low Temperature Cure Underfill

ALPHA® HiTech™ CU13-3150 is a one-component, low temperature thermal cure capillary underfill.  It is designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed circuit boards.

ALPHA® HiTech™ CU13-3150 does not contain any fillers. Its low viscosity property is excellent for BGA application, thus no preheat is required during the dispensing process. ALPHA® HiTech™ CU13-3150 is a reworkable product option.

Key Features:

  • Low Viscosity
  • Fast Cure at Low Temperature
  • Excellent Adhesion
  • Excellent Drop Shock
  • Reworkable
  • Halogen Free
  • Complies with RoHS Directive 2011/65/EU
 
  
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