ALPHA® HiTech™ CU31-3100

High Tg, Low CTE Underfill

ALPHA® HiTech™ CU31-3100 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA® HiTech™ CU31-3100 makes it ideal for use in the automotive industry.

ALPHA® HiTech™ CU31-3100, a product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages.  Good underfill capillary flow can be achieved by preheating the devices at 70 - 100°C during the dispensing process.

Key Features:

  • Excellent Thermal Cycling performance
  • Releases stress over a large area, primary stress is CTE mismatch between component and board
  • High Glass Transition Temperature
  • Low Coefficient of Thermal Expansion
  • Halogen Free
  • Complies with RoHS Directive 2011/65/EU
 
  
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