Die Transfer Film

(DTF)- Wafer Level

Argomax® 8020 film is the result of Alpha’s culture of innovation and one of its main advantages is its form factor.  No printing or drying is necessary before use, and the sinter material is where you need it: just under the die. This opens up more packaging options like complex multichip cavity packages, discretes, modules and LED’s.  The end result is consistent bond line thickness that is uniform and void-free.

A complete assembly process can be achieved on a single piece of equipment when you combine DTF with tack. You will also eliminate the waste created by printing.

Let Alpha demonstrate this DTF process on a wide range of die sizes at one of our global application laboratories.

ALPHA® Argomax® - Sinter Technology for reliable high volume manufacturing.

Application Paste Film Attachment to Ag, Au Attachment to Cu Argomax Product
Printing Dispensing
Power Modules X     X   20102020
X       X 5020
    X X   8020
    X   X 8050
Power Discretes   X   X   2040
  X     X 5040
    X X   8020
    X   X 8050
Bipolar Devices     X     8010
Cavity Packages   X   X   2040
  X     X 5040
    X X   8020
    X   X 8050
Wafer Level Processing     X X   8030
    X   X 8035


 
  
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