Ultra Fast Sintering

(UFS) – Speed

Ultra-Fast Sintering (UFS), from Alpha is the fastest most cost effective way to make your next generation power discrete components. ALPHA® Argomax® makes it a reality and is proud to bring to the power semiconductor market the most sophisticated and easy to implement sinter technology for die attach.

UFS with Argomax film is the only High Volume Manufacturing sintering technology that allows you to achieve the economics of epoxy die bonding with traditional equipment.

Many customers are already taking advantage of Argomax’s unsurpassed conductivity and reliability to create their highest performance products. You too, can create value by taking advantage of Argomax capabilities. Manufacture millions of parts per day using less capital equipment and factory floor space when compared to the conventional soft solder die bonding process.

ALPHA® Argomax® - Enables Ultra Fast Sintering (UFS)

 


Application Paste Film Attachment to Ag, Au Attachment to Cu Argomax Product
Printing Dispensing
Power Modules X     X   20102020
X       X 5020
    X X   8020
    X   X 8050
Power Discretes   X   X   2040
  X     X 5040
    X X   8020
    X   X 8050
Bipolar Devices     X     8010
Cavity Packages   X   X   2040
  X     X 5040
    X X   8020
    X   X 8050
Wafer Level Processing     X X   8030
    X   X 8035


 
  
*
(Press ctrl to select multiple)
*