Wafer Level

Argomax® 8030/8035 film is the result of Alpha’s culture of innovation. The Argomax® film form factor allows you to use sinter technology at the wafer level. By processing at wafer level, you can achieve your high volume manufacturing goals and not sacrifice the reliability, fast sintering speeds and low pressure processing you have come to expect from ALPHA® Argomax® pastes. In addition, you have even more options for easy, accurate ways to assemble and sinter your components, like complex multichip cavity packages, discretes, modules and LED’s. 

Argomax 8030/8035 provides manufacturers a uniform, void-free bond. No bondline tilt and a consistent bond line every time: this is what you get when you buy Argomax. Argomax 8030/8035, laminated to your wafer will allow you to have a ready solution for your high volume manufacturing needs and no more worries. Just place the wafer laminated in your production equipment and here you go.

ALPHA® Argomax® - Sinter technology that enables wafer bumping with high performance.

Application Paste Film Attachment to Ag, Au Attachment to Cu Argomax Product
Printing Dispensing
Power Modules X     X   20102020
X       X 5020
    X X   8020
    X   X 8050
Power Discretes   X   X   2040
  X     X 5040
    X X   8020
    X   X 8050
Bipolar Devices     X     8010
Cavity Packages   X   X   2040
  X     X 5040
    X X   8020
    X   X 8050
Wafer Level Processing     X X   8030
    X   X 8035



 

 
  
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