Head in Pillow Defect

Head-in-Pillow (HiP) or ball-and-socket defect is the non-wetting between the solder paste and the solder ball during the reflow process.  Without the formation of a unitary solder bump, the solder joint will exhibit electrical integrity but will fail under mechanical or thermal stress.  Alpha’s solder paste offers flux burn-off resistance with the establishment of a flux oxidation barrier to reduce HiP defects.

Alpha products that can help resolve Head In Pillow:

Solder Paste

Product Lead-Free SnPb Low Temp High Reliability
Low Ag Water Soluble
OM-340
X
         
OM-363 X



 
OM-390
X
    X
X
 

 

 

Alpha Tech Tip - BGA Head In Pillow


 
 
  
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