Non-Wet Open

Non-Wet Open (NWO) defect, also known as non-wet, lifted ball, hanging ball, ball-on-pad and ball-on-land, occurs during Surface Mount Technology (SMT) assembly reflow process when the solder joint between the Ball Grid Array (BGA) and the Printed Circuit Board (PCB) does not form.  This results in an electrical open.  Conventional inspection techniques may not detect these defects, which can be characterized as a pad wetting issue or no paste printed.  The chemistry of Alpha’s solder paste is formulated to offer optimal flux activity and high temperature tackiness to mitigate NWO defects.

 
  
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