Argomax® Newsletter #21
Posted 8/27/2014 by Julien Joguet
Ultra-Fast Sintering (UFS), 3 words that have never been put together before. ALPHA® Argomax® makes it a reality and is proud to bring to the power semiconductor market the most sophisticated and easy to implement sinter technology for die attach. UFS with Argomax® film is the only High Volume Manufacturing sintering technology that allows you to achieve the economics of epoxy die bonding with traditional equipment.
UFS with Argomax® film is the only High Volume Manufacturing sintering technology that allows you to achieve the economics of epoxy die bonding with traditional equipment.
Many customers are already taking advantage of Argomax®’s unsurpassed conductivity and reliability to create their highest performance products. You too, can create value by taking advantage of Argomax® capabilities.
Global leading Thyristor companies are also taking advantage of Argomax® 8010 capabilities. They are creating value in their products because they are achieving lower thermal resistance (>25%), increased reliability (>40%) and improved surge current (>10%). Sintering the assembly with Argomax® is extremely fast and straightforward because, only low pressures, low temperatures and short times are required. Argomax® sintered assemblies are superior in performance to air gap and brazed products. it easy to use in production, like the entire Argomax® product line.
For immediate response to any Argomax® questions you may have, please send an email to: email@example.com or visit our website: www.alphadieattach.com where you can read all of the published newsletters about ALPHA® Argomax® Sinter Technology and review the videos.