BGA Solder Bridging Tech Tip

BGA Solder Bridging Tech Tip

Posted 5/22/2014 by Paul Koep


Solder bridging is a defect that commonly occurs during reflow of BGA devices. The BGA device can warp during reflow causing adjacent BGA spheres to come in contact and form a solder bridge.  Check out Alpha’s Tech Tip to see possible causes of bridging in BGA devices and recommendations for solutions.


BGA solder bridging


Click here to download Alpha's BGA Solder Bridging Tech Tip.



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