BGA Solder Bridging Tech Tip
Posted 5/22/2014 by Paul Koep
Solder bridging is a defect that commonly occurs during reflow of BGA devices. The BGA device can warp during reflow causing adjacent BGA spheres to come in contact and form a solder bridge. Check out Alpha’s Tech Tip to see possible causes of bridging in BGA devices and recommendations for solutions.
Click here to download Alpha's BGA Solder Bridging Tech Tip.