Are Your Thick, High Density PCBs Creating Assembly Problems in Your Wave Soldering Process?
Posted 5/15/2014 by Michael Previti
As reliability and component miniaturization concerns have resulted in the use of thicker PCBs in many processes, these boards have created electronic assembly challenges such as bridging, solder balling, achieving complete hole fill, pin testing accuracy and difficulty in meeting halogen-free process goals. The right wave solder flux can help minimize these challenges and result in higher levels of process throughput and PCB reliability.
ALPHA® EF-8800HF is a new halogen-free, mid-solids, alcohol based, no clean wave soldering flux that performs particularly well on thicker PCBs and standard boards as well. It was developed for spray fluxing applications for (standard and Low Ag SAC alloys), and has demonstrated stable performance even under long exposure to higher preheat and solder pot temperatures. EF-8800HF provides superior hole-fill, pin testing and solder balling performance, while delivering excellent lead-free solder joint cosmetics with evenly spread, tack-free residue.
ALPHA® EF-8800HF flux passes IPC and Bellcore tests, and is classified ORL0 per IPC J-STD-004. It complies with all current Halogen-Free industry standards, and passes IEC 61249-2-21 and the JEDEC Guideline for low-halogen electronic products making it environmentally friendly.