LED Lighting

Key Requirements

High thermo-mechanical reliability
High value, lowers total cost per lumen
Maximize light output with minimal degradation over time
Transparent and minimal residues

Product Type	Product Name	Low Temp	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA OM-362 OM-362 is the next generation low-void solder paste product. Consistent distribution and void reduction can improve thermal dissipation generated from the die of your leading BTC package.
Solder Paste	ALPHA OM-353 Innolot / SAC305 Lowest post reflow residue spread of Alpha’s chemistries Excellent electrochemical reliability down to 0.200mm spacing Low HIP and NWO Defects Highest thermo-mechanical reliability at temperatures above 120°C (Innolot)
Solder Paste	ALPHA CVP-390V Innolot / SAC305 Excellent electrochemical reliability down to 0.100mm spacing Fine feature printability down to 01005 feature size Highest thermo-mechanical reliability at temperatures above 120°C (Innolot)
Solder Preforms	ALPHA BTC-578 Accuflux Preforms Innolot / SAC305 / Low-temp Increasing thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stackup issues through increased solder volume
Solder Preforms	ALPHA Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 Innolot / SAC305 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305 Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Adhesive	ALPHA HiTech AD43-9600W Low Temperaturer[LT] Adhesive Fast curing enabling high throughput manufacturing White coloring eliminates ‘flaring’ during initial LED illumination Good adhesion strength at elevated temperature
Adhesive	ALPHA HiTech SM42-1311 SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Adhesive	ALPHA HiTech SM42-120P SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA SACX Plus 0307 Low Silver (0.3%) for improved value vs. SAC305 Low Copper dissolution and low drossing Excellent for most standard assemblies
Liquid Flux	ALPHA EF-2100 ORL0 VOC free Passes SIR IPC J-STD-004B Wide process window
Liquid Flux	ALPHA EF-6000 ORL0 Passes SIR IPC J-STD-004 High activity, rosin-free formula can be cleaned with DI water
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	Kester 951 ORL0 Passes SIR IPC J-STD-004 Rosin-free formula for clean post-soldering surface
Liquid Flux	Kester NF1060-VF ORM0 VOC free Passes SIR IPC J-STD-004B Exceptional wetting with excellent hole-fill
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile

Printing Dispensing & Jetting Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT

Key Requirements

High thermo-mechanical reliability
High value, lowers total cost per lumen
Maximize light output with minimal degradation over time
Transparent and minimal residues

Product Type	Product Name	Low Temp	PB Free	Halogen Free	VOC Free
Solder Paste	ALPHA OM-362 OM-362 is the next generation low-void solder paste product. Consistent distribution and void reduction can improve thermal dissipation generated from the die of your leading BTC package.
Solder Paste	ALPHA OM-353 Innolot / SAC305 Lowest post reflow residue spread of Alpha’s chemistries Excellent electrochemical reliability down to 0.200mm spacing Low HIP and NWO Defects Highest thermo-mechanical reliability at temperatures above 120°C (Innolot)
Solder Paste	ALPHA CVP-390V Innolot / SAC305 Excellent electrochemical reliability down to 0.100mm spacing Fine feature printability down to 01005 feature size Highest thermo-mechanical reliability at temperatures above 120°C (Innolot)
Solder Preforms	ALPHA BTC-578 Accuflux Preforms Innolot / SAC305 / Low-temp Increasing thermal conductivity and heat dissipation through void reduction Low flux residue improves electrochemical reliability Prevents mechanical stackup issues through increased solder volume
Solder Preforms	ALPHA Tape and Reel Preforms High solder volume precision and production yields using pick and place Available in many alloys, sizes and shapes
Cored Wire	ALPHA Telecore HF-850 Innolot / SAC305 Performs well with all standard pad finishes Can be used in both robotic and manual soldering processes ROL0
Cored Wire	ALPHA Telecore XL-825 SAC305 Best for difficult to solder surfaces Can be used in both robotic and manual soldering processes ROL1
Cored Wire	Kester 268 SAC305 Optimzed for low spatter robotic soldering Can be used for manual and automated soldering processes Zero halogen ROL0
Cored Wire	Kester 285 SAC305 Highly active for soldering difficult surfaces while retaining ROL0 class Can be used for manual and automated soldering processes ROL0
Adhesive	ALPHA HiTech AD43-9600W Low Temperaturer[LT] Adhesive Fast curing enabling high throughput manufacturing White coloring eliminates ‘flaring’ during initial LED illumination Good adhesion strength at elevated temperature
Adhesive	ALPHA HiTech SM42-1311 SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Adhesive	ALPHA HiTech SM42-120P SMD Adhesive Non-Sagging Excellent adhesion on FR4 Resists change due to high heat post application processing (i.e., wave soldering)
Bar & Solid Wire Solder	ALPHA SAC305 Excellent soldering performance High thermal fatigue resistance Widely used
Bar & Solid Wire Solder	ALPHA SACX Plus 0807 Low Silver (0.8%) for improved value vs. SAC305 SAC305-like soldering and reliability performance on complex assemblies Low Copper dissolution and low drossing
Bar & Solid Wire Solder	ALPHA SACX Plus 0307 Low Silver (0.3%) for improved value vs. SAC305 Low Copper dissolution and low drossing Excellent for most standard assemblies
Liquid Flux	ALPHA EF-2100 ORL0 VOC free Passes SIR IPC J-STD-004B Wide process window
Liquid Flux	ALPHA EF-6000 ORL0 Passes SIR IPC J-STD-004 High activity, rosin-free formula can be cleaned with DI water
Liquid Flux	ALPHA EF-6808HF ROL0 Passes SIR IPC J-STD-004B Excellent for most standard complexity assemblies
Liquid Flux	Kester 951 ORL0 Passes SIR IPC J-STD-004 Rosin-free formula for clean post-soldering surface
Liquid Flux	Kester NF1060-VF ORM0 VOC free Passes SIR IPC J-STD-004B Exceptional wetting with excellent hole-fill
Liquid Flux	Kester NF372-TB ROL0 Passes SIR IPC J-STD-004B Sustained flux activity in challenging heating profile

Printing Dispensing & Jetting Gluing, Underfilling and Edgebonding Selectively Increasing Solder Volume - SMT

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