SMTA International 2017
September 19-20, 2017
Rosemont, IL - USA

SMTAI has been recognized as a truly different type of industry event because of the high quality technical information and the networking opportunities that cannot be found anywhere else in the industry.

Visit Alpha at Booth #1016
smta.org/smtai

Be sure to attend the Alpha presentations during the Conference!

Tuesday, September 19
Time: 11:00 AM
Topic: Void Reduction Strategy for Bottom Termination Components (BTC) Using Special Flux Coated Preforms
By: Anna Lifton
Location: Theater, Expo Show Floor

Wednesday, September 20
Time: 8:00 AM
Topic: Novel Mid-Temperature Alloy for Enabling Solder Processing Temperature Hierarchy in SMT Assembly
By: Ranjit Pandher, Ph.D.
Location: Theater, Expo Show Floor

Time: 8:00 AM
Topic: High Performance Electronic Interconnect Materials Characterization – Techniques & Challenges
By: Nicholas Herrick
Location: Room 44

Time: 11:00 AM
Topic: Low Temperature Soldering Using Sn-Bi Alloys
By: Morgana Ribas, Ph.D.
Location: Room 49

Time: 11:00 AM
Topic: A Comparison of Localized Electronics Cleanliness Testing and Surface Insulation Resistance
By: Jason Fullerton
Location: Room 42

Time: 2:00 PM
Topic: Process, Design, and Material Factors for Voiding Control for Thermally Demanding Applications
By: Amit Patel
Location: Room 46

Time: 2:00 PM
Topic: Effect of Voids on Thermo-Mechanical Reliability of Solder Joints
By: Morgana Ribas, Ph.D.
Location: Room 46

Thursday, September 21
Time: 10:00 AM
Topic: Low Temperature Solder Paste Process Advantages
By: Traian C. Cucu
Location: Room 47