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Alpha to Promote Advanced Sinter Technology at Power Electronics Show, Moscow, Russia

Somerset, NJ October 19, 2018 – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will promote its range of high reliability silver sintering solutions, as well as its latest preform products for power semiconductor applications at the Power Electronics Expo, Moscow, Russia 23rd-25th October.

"Alpha's Argomax® silver sinter products have been designed to meet the power semiconductor market's demand for increased die attach reliability and cost effective high volume manufacturing", comments Ferenc Ago, Area Sales Manager for Hungary and Russia at Alpha Assembly Solutions. "Argomax® creates extremely high thermal and electrical conductivity silver bonds which deliver exceptional reliability as well as flexible bondline thickness for even the most challenging technologies."

Alpha's latest preform products for power semiconductor applications will also be featured at the show, including ALPHA® TrueHeight®.Preforms and ALPHA® PowerBond® Preforms. ALPHA® TrueHeight® Preforms prevent die tilt by enabling repeatable bondline thickness, which results in predictable reliability and performance. ALPHA® PowerBond® Preforms are based on a family of high reliability alloys containing antimony for increased strength and thermal fatigue resistance.

To learn more about Alpha’s solutions for power semiconductor applications visit us at booth #B221 or visit the Alpha website.

Power Electronics Expo

Date: 23rd – 25th October

Venue: Crocus Expo, Moscow Russia

http://www.powerelectronics.ru/?lang=en-GB

Contact:   
Emma Giles
Emma.Giles@alphaassembly.com

 
  
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