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Macdermid Alpha To Present Solder Paste Selection Challenges For Bottom Termination Components (Btc) Attach At Ceia In Chengdu China

(Waterbury, CT USA) – May 27, 2019, the Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronic soldering and bonding materials, will be presenting a technical paper on “Solder Paste Selection Challenges for Bottom Termination Components (BTC) Attach” at China Electronics Intelligent Automation Conference (CEIA) on May 29 in Chengdu China. This will be the first time to present our technical paper at CEIA.

Bottom Terminated Component (BTC) use has become extensive in electronic assembly, especially the use of Quad Flat No-lead (QFN) packages. Low cost and small size with improved thermal and electrical performance make BTC components very attractive for many applications.

Implementation of BTC components come with challenges. The low standoff, large central thermal pad and lack of leads result in co-planarity issues due to board warpage and Coefficient of Thermal Expansion (CTE) mismatch. Low standoff and a large central pad may favor increased voiding compared to other package designs. Therefore, in this paper, two solder paste chemistries and several printing parameters will be evaluated to achieve consistent solder paste deposition across the assembly.

For additional information about MacDermid Alpha’s latest technologies and products, please visit the MacDermidAlpha.com.

CEIA - China Electronics Intelligent Automation Conference

Date:                 29th May 2019, Wednesday

Time:                14:15pm

Hotel:                Crowne Plaza Chengdu Wenjiang

Venue:             No.619A North Phoenix Street, Wenjiang District, Chengdu, 51611130, China

Topic:                Solder Paste Selection Challenges for Bottom Termination Components (BTC) Attach 

Presented by:  Annie Yang, Regional Marketing Manager of MacDermid Alpha Electronics Solutions

Contact: Annie Yang - Regional Marketing Manager, Assembly Solutions, Annie.Yang@MacDermidAlpha.com

About MacDermid Alpha Electronics Solutions

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, we provide solutions that power electronics interconnection.  We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain.   The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients.  Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find more at MacDermidAlpha.com.

 
  
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