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Macdermid Alpha to Present Prevention of Weak Solder Joint Formation in Multi Busbar Interconnection at Snec Pv Power Expo in Shanghai China

(Waterbury, CT USA) – May 29, 2019, the Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronic soldering and bonding materials, will be presenting a technical paper on “Prevention of Weak Solder Joint Formation in Multi Busbar (MBB) Interconnection” during the SNEC 13th (2019) International Photovoltaic (PV) Power Generation and Smart Energy Exhibition & Conference taking place June 3-6 in Shanghai, China.

The paper “Prevention of Weak Solder Joint Formation in Multi Busbar (MBB) Interconnection” will be focus on addressing the factors affecting reliability of solder joints in MBB technology. “In multi Busbar (MBB) interconnection, between 6 and 15 round copper wires are soldered onto more than 50 solder pads on the front side of the solar cell. This approach reduces silver consumption for the front side metallization and increases the module efficiency by lowering series resistance and improved light harvesting.” said Narahari Pujari. “However, due to reduced cross sectional area of silver pad and wire, reliability of solder joints remained one of the biggest concerns in this technology. Lowered peel strength, wire crippling and cold or dry solder joint formation are the most common issues.” Therefore, Pujari’s presentation is going to review and analyze the formation of weak joints and ways to obviate the same.

For more information on Alpha’s Solder Interconnect Technology, or Alpha’s other solutions for Photovoltaic applications, visit the MacDermidAlpha.com.

SNEC 13th (2019) International Photovoltaic Power Generation and Smart Energy Conference

Date:                 4th June 2019

Time:                14:30pm

Venue:              Kerry Hotel Pudong, Shanghai, China

Topic:                Prevention of Weak Solder Joint Formation in Multi Busbar (MBB) Interconnection

Presented by:  Narahari Pujari, R&D Manager of MacDermid Alpha Electronics Solutions

Contact: Narahari Pujari, R&D Manager, Assembly Solutions, Narahari.Pujari@MacDermidAlpha.com

About SNEC

SNEC is international PV tradeshow with high influence in China, Asia and rest of the world. SNEC showcases PV manufacturing facilities, materials, PV cells, PV application products & modules, and PV project and system, covering every section of the whole PV industry chain. The conference provides an excellent platform for the world's PV experts and scientists to showcase and share the latest developments in solar energy technologies.

About MacDermid Alpha Electronics Solutions

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, we provide solutions that power electronics interconnection.  We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain.   The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients.  Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find more at MacDermidAlpha.com.

 
  
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