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MacDermid Alpha Presents Three Technical Papers at SMTA China East Technical Conference 2021 in Shanghai

(Waterbury, CT USA) – April 15, 2021 - The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will be presenting three technical papers: High-Reliability, Fourth Generation Low-Temperature Solders: Improving Drop Shock Performance”, “Can Low Cost Silver-Free Alloys Be Used in Type II and III Assemblies?” and “Can All Liquid Fluxes Work Well on A Reflowed OSP Pad Finish?at the SMTA China East Technical Conference taking place from April 21-22 in Shanghai, China.

 

Ever evolving packaging and assembly requirements have been driving the design of solder alloys with higher thermal and mechanical reliability. Low temperature solders (LTS) can potentially reduce material and energy costs, promote long-term reliability, and help reduce labor and equipment maintenance costs. The paperHigh-Reliability, Fourth Generation Low-Temperature Solders: Improving Drop Shock Performance will discuss how the drop shock performance of third and fourth generation SnBi solder alloys is affected by alloy melting behavior, processing, and assembly conditions.

 

Hole fill requirements in Types II and III assemblies had traditionally required the use of silver bearing lead-free alloys during wave soldering. As a result of continuous alloy developments, an opportunity now exists to employ a silver-free, lead-free alloy that can meet such hole fill requirements. The second paper Can Low Cost Silver-Free Alloys Be Used in Type II and III Assemblies?lays out the key elements working together to deliver optimal performance at the lowest cost currently available in a matured process by applying SAC305.

 

Printed circuit board (PCB) assemblers are increasingly using Organic Solderability Preservatives (OSP) as their preferred surface finish due to several advantages of this coating over metallic surface finishes. However, OSP coatings after exposure to one or more thermal excursions can become more challenging to solder especially during wave solder applications. The third paper Can All Liquid Fluxes Work Well on A Reflowed OSP Pad Finish? focuses on the investigation of the chemical changes OSP coating undergoes in thermal excursions.

 

To learn more about MacDermid Alpha’s vast product offering and capabilities, please visit MacDermidAlpha.com.

 

 

SMTA China East Technology Conference

Date: April 21st – 22nd 2021

Venue: Room No. 6, B2, Shanghai World Expo Exhibition & Convention Centre

Speaker: William Yu, Senior Technical Services Manager

 

Topic 1: High-Reliability, Fourth Generation Low-Temperature Solders: Improving Drop Shock Performance

Date/time: April 21st (Wed) / 11:55-12:30

 

Topic 2: Can Low Cost Silver-Free Alloy Be Used in Type II and III Assemblies?

Date/Time: April 22nd (Thu) / 10:45-11:20

 

Topic 3: Can All Liquid Fluxes Work Well on A Reflowed OSP Pad Finish?

Date/Time: April 22nd (Thu) / 14:20-14:55

 

 

About MacDermid Alpha Electronics Solutions

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester and MacDermid Enthone brands, we provide solutions that power electronics interconnection.  We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain.   The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients.  Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.

 

Contact:

Name: William Yu

Title:  Senior Technical Services Manager - Assembly Solutions

Email: William.Yu@MacDermidAlpha.com
 
  
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