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MacDermid Alpha to Present on Materials for 3D Structural Electronics at LOPEC 2021 Virtual Exhibition and Conference

(Waterbury, CT USA) – March 18, 2020 – MacDermid Alpha Electronics Solutions, a global leader in electronic materials for assembly and semiconductor packaging, will be presenting “Next Generation Electronic Materials for Structural and 3D In-Mold Electronics” at LOPEC 2021 Virtual Exhibition and Conference on March 25, 2021.


Dr. Nirmalya Kumar Chaki, Manager, Advanced Materials Research will present the latest innovations in Electronic Inks as part of the 3D Structural Electronics Session.  His presentation will focus on three main areas: 1) Trends and drivers in formable materials for In-Mold electronics (IME) applications; 2) Performance of Formable Silver and Dielectric Inks; and 3) 3D In-Mold Electronics Technology Demonstrators. 


MacDermid Alpha has been developing a compatible suite of conductive inks and materials to meet the unique requirements and reliability standards for Flexible Hybrid Electronics (FHE) as well as In-Mold Electronics (IME). “We are pleased and excited to participate in this global forum organized by LOPEC and are looking forward to presenting MacDermid Alpha’s innovative solutions for Flexible Hybrid Electronics (FHE) and In-Mold Electronics (IME).” said Dr. Nirmalya Kumar Chaki. 


LOPEC will be held from March 23 – March 25, 2021 as a virtual event. To register for the event please visit the LOPEC website. More information about MacDermid Alpha’s solutions for Flexible, Formable and Printed Electronics can be found at



About MacDermid Alpha Electronics Solutions:


Through the innovation of specialty chemicals and materials under our Alpha, Kester, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection.  We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain.   The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients.  Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.
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