Atrox ® Atrox ®

For LED Applications

ALPHA® Atrox ® is a family of silver-filled die attach adhesives. The Atrox ® technology was specifically designed for LED manufacturers that require low temperature cure, low stress, a range of thermal conductivities, and high throughput die attach solution for low power, mid-power and certain high power LEDs.

Features and Benefits
  • Atrox ® has a low electrical resistance on oxidized Cu surfaces which will enable excellent thermal and electrical bond performance over the lifetime of the LED application.
  • High reliability: minimal die-top contamination.
  • High throughput dispense: no tailing/dripping, repeatable and consistent dispense, compatible with commercial die-bonders
  • Capable of bare Si and bare Cu adhesion*

 

HT900-1

HT900-3*

HT900-6B*

Application Platform

Syringe Dispense

 

 

Cure Temp

130°C for 30min
165°C for 3min

200°C

175°C

Thermal Conductivity

>7W/mK

25W/mK

90W/mK

Substrate

Cu Leadframe

Cu Leadframe

Plated Leadframe

Surface Finish Compatibility

Plated Leadframe, Au + Ag

Plated Leadframe, Bare Cu, Ag

Au, Ag, Bare Cu

Chip Structure “Recommendation”

Lateral
Vertical

Lateral
Vertical

Lateral
Vertical

 
  
*
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