Package on Package


The high packing density of interconnections on Ball Grid Arrays (BGA) and Chip Scale Packages (CSP) is multiplied with the Package on Package (POP) design.  Functionality is enhanced while the footprint is preserved.  Alpha has engineered dip flux and dip solder paste that enables a tight process control achieved through superior process repeatability.

Products for Package on Package Applications

Solder Paste

Product Lead-Free SnPb Low Temp High Reliability Low Ag Water Soluble
PoP-33 X




Paste Flux


Alpha Stencils


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