Coming Soon

Alpha delivers the most innovative, high quality and reliable products to the electronics assembly industry.  We are pleased to announce the following product innovations will soon be available:

ALPHA® OM-347 Solder PasteALPHA® OM-347 Solder Paste Tube and Jar

ALPHA® OM-347 is a solder paste formula designed as a cleanable, no-clean material. It can print and reflow Type 4 and Type 5 powder to meet market segments requiring ultra-fine feature applications. ALPHA® OM-347 has been tested to give excellent printing performance and the residue after reflow can be easily cleaned or removed with a broad range of cleaners including Aquanox A4241, ALPHA® BC-3350, or nPB-based solvents.



ALPHA® AccuFlux™ PreformsALPHA® AccuFlux™ Preforms

ALPHA® AccuFlux Preforms are designed specifically for large area power components that require consistent low-voiding solder joints from normal SMT processes. They contain an ultra-low voiding flux formulation that is deposited very accurately from preform to preform ensuring repeatable performance every time. ALPHA® AccuFlux preforms are available in Tape & Reel for easy assembly in SMT reflow applications. Various flux coating levels, customized shapes and thicknesses allow Alpha the ability to address most every application or assembly configuration.

 


ALPHA® Powerbond™ PreformsALPHA® Powerbond™ Preforms

ALPHA® Powerbond alloys are designed specifically for high reliability Power Module assembly applications targeting junction temperatures to 175°C. Alpha’s advanced alloy development capability has allowed us to take the highest reliability lead-free alloys and adjust them to provide thermal fatigue properties closer to high-lead alloys. The preforms are ideal for top side die clip attach, die attach, heat spreader and heat sink solder solutions. 


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