Camera Modules and Flexible Circuit Board Assembly

Assemblies in this segment are used in smartphones, some wearable electronics and a variety of other non-communications related devices. Camera modules are generally quite small and use components which are sensitive to a variety of mechanical stresses.
Alternating row colors

Alternating row colors

Camera
   

Key Requirements for Joining Materials

  • High mechanical and electrical reliability
  • Fine feature capable
  • Minimal residues
  • High throughput, low defects

Product Type

Product

Low Temp

PB Free

Halogen Free

Solder Paste

ALPHA® OM-353 SAC305 / SACX Plus 0307

  • Repeatable printing down to 0.3mm/.012” pitch and 01005 passives
  • Lowest post reflow residues of Alpha’s chemistries
  • Low HIP and NWO Defects
  • Available in low silver SACX Plus alloy(s) for improved value
  Pb Free  Halogen Free 
Solder Paste

ALPHA® OM-550 HRL1

  • Best mechanical performance of Alpha’s low temperature solder alloys
  • Repeatable printing down to 0.3mm/.012” pitch and 01005 passives
  • Significant reduction in warpage-induced defects such as HIP and NWO
Low Temp   Pb Free  Halogen Free
Solder Paste

ALPHA® WS-820

  • Water Soluble
  • Repeatable printing down to 0.4mm/.016” pitch
   Pb Free  
Solder Paste

ALPHA® OM-347

  • Easily cleaned with solvent
  • Repeatable printing down to 0.4mm/.016” pitch
   Pb Free Halogen Free 
Solder Paste

ALPHA® JP-510 SAC305

  • Jettable to 0.5mm/.020” pitch
  • High mechanical and electrochemical reliability
  Pb Free   Halogen Free
Solder Paste

ALPHA® JP-501 SnBiAg

  • Low HIP and NWO Defects
  • Jettable to 0.5mm/.020” pitch
Low Temp   Pb Free  Halogen Free
Preforms

ALPHA® Tape and Reel Preforms

  • High solder volume precision and production yields using pick and place
  • Available in many alloys, sizes and shapes
  • Flux coated versions available (*some fluxes contain halogens)
 Low Temp Pb Free   Halogen Free
Cored Wire

ALPHA® Telecore® HF-850 SAC305 / SACX Plus 0307

  • Performs well with all standard pad finishes
  • Can be used in both robotic and manual soldering processes
  • ROL0
  Pb Free   Halogen Free
Cored Wire

ALPHA® Telecore® XL-825 SAC305 / SACX Plus 0307

  • Best for difficult to solder surfaces
  • Can be used in both robotic and manual soldering processes
  • ROL1
   Pb Free  
Underfill

ALPHA® HiTech™ CU13-3150

  • Low temperature cure
  • Fast Flow
  • Reworkable
    Halogen Free 
Adhesives

ALPHA® HiTech™ AD13-9690BH

  • Low temperature cure
  • Excellent Adhesion on LCP, Magnet
  • Excellent Drop Impact Performance
    Halogen Free 
 
  
*
(Press ctrl to select multiple)
*