Low Temperature Adhesives

ALPHA® HiTech™  Low Temperature Adhesives are one component, heat curable materials. They are engineered for use to mechanically bond heat sensitive substrates with each other at temperatures as low as 80°C.

 

ALPHA® HiTech™ Low Temperature products are designed for use in Camera Modules, Actuators and BLU LED applications. Users of the ALPHA® HiTech™Series of Low Temperature Adhesives can benefit from the following key product features:

  • Products Selection Availability to match common materials such as PA9T (a polyamide, nylon family), LCP (Liquid Crystal Polymer), PC (polycarbonate) & Metal
  • Available in Black and White
  • Excellent Adhesion Strength at room temperature and at higher temperature
  • Halogen Free

Low Temp     Low temp


AD13-9521B

Low Viscosity, Low Temperature Adhesive

ALPHA® HiTech™ AD13-9521B is a one-component low temperature cure epoxy system.  It is suitable for bonding heat sensitive devices.

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AD13-9690BH

Low Temperature Adhesive

ALPHA® HiTech™ AD13-9690BH is a one-component, low temperature cure epoxy system.  It is suitable for bonding heat sensitive devices and is specially designed for camera module application.

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AD13-9620B

Low Temperature Adhesive

ALPHA® HiTech™ AD13-9620B is a one-component, low temperature cure epoxy system.  It is engineered for the bonding of heat sensitive devices.

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AD43-9600W

Low Temperature Adhesive

ALPHA® HiTech™ AD43-9600W is a one-component, low temperature cure epoxy system.  It is specially designed to bond the lens onto a PCB bar for BLU (Back Light Unit) application.

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