ALPHA® HiTech Low Temperature Adhesives

ALPHA HiTech Low Temperature Adhesives are one component, heat curable materials. They are engineered for use to mechanically bond heat sensitive substrates with each other at temperatures as low as 80°C.

 

ALPHA HiTech Low Temperature products are designed for use in Camera Modules, Actuators and BLU LED applications. Users of the ALPHA® HiTech™Series of Low Temperature Adhesives can benefit from the following key product features:

  • Products Selection Availability to match common materials such as PA9T (a polyamide, nylon family), LCP (Liquid Crystal Polymer), PC (polycarbonate) & Metal
  • Available in Black and White
  • Excellent Adhesion Strength at room temperature and at higher temperature
  • Halogen Free

Low Temp     Low temp

    

AD43-9600W

Low Temperature Adhesive

ALPHA HiTech AD43-9600W is a one-component, low temperature cure epoxy system.  It is specially designed to bond the lens onto a PCB bar for BLU (Back Light Unit) application.

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AD13-9521B

Low Temperature Adhesive

ALPHA HiTech AD13-9521B is specially designed for use in camera modules. This product has good adhesion to a wide range of plastic and metal surfaces used in the camera module assembly.

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AD13-9620B

Low Temperature Adhesive

ALPHA HiTech AD13-9620B is engineered for use in the camera module application. It exhibits excellent adhesion strength for bonding between LCP to Magnet surfaces.

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