ALPHA® HiTech AD13-9690BH

Low Temperature Adhesive

ALPHA HiTech AD13-9690BH is a one-component, low temperature cure epoxy system.  It is suitable for bonding heat sensitive devices and is specially designed for camera module application.

ALPHA HiTech AD13-9690BH exhibits high adhesion strength between LCP to Magnet surfaces. This characteristic results to excellent Drop Impact results when tested on camera module housing and excellent LCP-Magnet Drop Impact performance.

Key Features:

  • Fast Cure at Low Temperature
  • Excellent Adhesion on Nylon (PA9T) and metal substrates. It also able to bond well on Liquid Crystal Polymer (LCP) and Polycarbonate surfaces.
  • Excellent Drop Shock for units bonded to LCP
  • Halogen Free
  • Complies with RoHS Directive 2011/65/EU
 
  
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