UV Adhesives

ALPHA® HiTech™ UV Adhesives are one-component, ultraviolet curable materials. They can be used to mechanically bond substrates together at below 25oC. The instant curing  capability of these products, within seconds under UV exposure, makes them ideal for production processes with high throughput requirements.  

ALPHA® Hi-Tech™ UV Adhesives are designed to be used in the following applications: Mobiles – Main PCB boards, Wireless  Charger component, Optical Pick Ups (CD ROM, computers), Camera Modules, LCD display(TV). Users of the ALPHA® HiTech™  Series of UV Products can benefit from the following key product features:

  • Products Selection Availability to match common materials
  • Excellent Adhesion Strength at room temperature and higher temperatures
  • Excellent Resistance to Moisture Absorption
  • Fast Throughput performance
  • Halogen Free

UV


UP44-5566T

Ultraviolet Cure Adhesive

ALPHA® HiTech™ UP44-5566T is a one-component UV cure system.  It is suitable for fast curing and bonding in various applications such as coating and fixing of components.

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UP44-5311F

Ultraviolet Cure Encapsulant

ALPHA® HiTech™ UP44-5311F is a one-component UV cure system. It is designed to improve the attachment strength of solder joints by encapsulating the material over the chips or other components. It prevents chips and IC devices from dropping out and cracking. It has the unique characteristic of appearing as fluorescent blue light when exposed to black light.

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