ALPHA® HiTech™ CF12-4485B

Cornerfill Epoxy

ALPHA® HiTech™ CF12-4485B is a one-component, low temperature cure, cornerfill epoxy system. It is designed to provide protection to the solder joint during mechanical stress. 

ALPHA® HiTech™ CF12-4485B is an excellent and effective low cost option to conventional underfilling process because higher material volume for capillary flow is not required.

Key Features:

  • Excellent Adhesion Strength
  • Excellent Thermal Cycling performance
  • Multiple Curing Options Available
  • Halogen Free
  • Complies with RoHS Directive 2011/65/EU
 
  
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