ALPHA® HiTech™ EN21-4210 Series

Solder Joint Strengthening Encapsulants

ALPHA® HiTech™ EN21-4210 Series of products are one-component epoxy systems designed to encapsulate the chip component thus protecting the device and strengthening the solder joints. These encapsulants prevent chip and IC devices from dropping out. In addition, these protect the chip/die from cracking when used as a Glob Top.

ALPHA® HiTech™ EN21-4210 Series has a high hardness property which makes it very suitable for assembly of components requiring excellent reinforcement strength. ALPHA® HiTech™ EN21-4210 Series is a non-reworkable encapsulant product option.

Key Features:

  • Excellent Impact Bending
  • Excellent Drop Shock
  • Excellent Impact Resistance
  • Halogen Free
  • Impart Water Proofing Property
  • Complies with RoHS Directive 2011/65/EU
 
  
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