ALPHA® HiTech EN31-4007 Series

Solder Joint Strengthening Encapsulants

ALPHA HiTech EN31-4007 Series of encapsulants are one-component epoxy systems designed to improve the attachment strength of solder joints by encapsulating the material over the chip component. These products prevent chip and IC devices from dropping out.   For Glob Top application, these protect the chip/die from cracking.

ALPHA HiTech EN31-4007 Series excellent flexibility allows it to dynamically flex in tandem with components and prevent cracking, especially in FPCB assembly process. These products have been tested to provide Excellent Adhesion on FR4, Flexible Polyimide(FPC) and PET substrates. Users of ALPHA HiTech EN31-4007 Series of encapsulants have the option to perform rework as needed as the products are highly reworkable.

Key Features:

  • Excellent Impact Bending
  • Excellent Drop Shock
  • Excellent Impact Resistance
  • Highly Reworkable
  • Imparts Water Proofing Property
  • Complies with RoHS Directive 2011/65/EU
  • Halogen Free
  • Available in Pale Yellow, Black and Fluorescent colors
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