Electrically and Highly Thermally Conductive Die Attach Adhesive for LED

ATROX® HT900-1 is a thermosetting conductive die attach adhesive designed for LED packages. The unique chemistry of the ATROX® HT900-1 allows the material to be cured at lower temperatures compared to standard die attach adhesives, while maintaining its material properties. ATROX® HT900-1 has low resin bleed out and low condensable organics which ensure excellent package reliability.

Features & Benefits

  • Good Thermal Conductivity > 5 W/m-K
  • Can be cured by thermal processing in standard IR, full convection, conduction or vapor phase oven equipment
  • Compatible with either nitrogen or air cure conditions
  • Short cure time, low temperature with excellent thermal stability
  • Low RBO and compatible with multiple lead-frame surfaces: Cu & PPF (NiPdAu)
  • Compatible with Bare Si and metalized die surfaces
  • High through put dot and pattern dispense capable with excellent workability across all leadframe designs
  • Lower temperature cure for exposed pad packages
  • Ultra Low voiding on medium to large size die on various leadframe / component finishes.
  • Stable contact resistance during stress testing and device operation
Application Methods
  • Syringe / Shower Head Dispense
  • Screen / Stencil Print
(Press ctrl to select multiple)