Electrically and Highly Thermally Conductive Die Attach Adhesive

ATROXTM HT900-6B is a low stress thermosetting conductive die attach adhesive with high thermal conductivity designed for high power LED packages. ATROXTM HT900-6B has low resin bleed out and low condensable organics which ensure excellent package reliability.

Features & Benefits

  • High Thermal Conductivity > 90 W/m-K
  • Ultra-Low stress material for larger size die packages (> 50mm2)
  • Compatible with multiple lead-frame surfaces: Ag, Cu & PPF (NiPdAu)
  • Compatible with Bare Si and metalized die surfaces
  • High through put pattern dispense capable with excellent workability across all leadframe designs
  • Ultra-Low voiding on larger die on various leadframe / component finishes
  • Excellent reliability properties and able to pass MSL3 conditions
  • Compatible with either nitrogen or air cure conditions

Application Methods

  • Syringe Dispense
  • Screen / Stencil Print
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