ALPHA® LUMET® FC33 is a lead-free, no-clean solder paste designed for fine feature applications like flip chip LED interconnects. ALPHA® LUMET® FC33 is designed to enable the use of ALPHA® SACX0307 alloy with Type 6 solder powder. LUMET® FC33 flux system has long work life and is suitable for applications that require reproducible solder transfer by dipping or pin transfer over several hours. It leaves a clear, colorless high resistivity residue after reflow.

Features & Benefits

  • Excellent coalescence for fine and ultra fine feature deposits
  • Good void performance (IPC Class III)
  • Zero Halogen, no halogen intentionally added
  • Excellent Pin Testing property and Pass JIS Copper Corrosion Test
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