Zero Halogen, RoHS Compliant Solder Paste for Ultra-Fine Feature LED Assembly & Wafer Bumping, Available in SAC305 & SnCu0.7

ALPHA® LUMET® FC39 is a lead-free, no-clean solder paste designed for fine feature applications including Chip Scale, Flip-Chip LED package assembly and wafer bumping of LED wafers. ALPHA® LUMET® FC39 is designed to enable the use of high reliability ALPHA Maxrel, Maxrel Plus and SAC305 alloys with Type 6 and 7 solder powder.


  • Fine feature capable – rectangular pads as small as 60um with 60um micron spacing
  • Hot slump performance pass at 0.3 mm
  • Acceptable random solder ball performance in nitrogen reflow
  • Excellent coalescence for fine and ultra-fine feature deposits
  • Good void performance (IPC Class III)
  • Zero Halogen, no halogen intentionally added
  • Excellent Pin Testing property and Pass JIS Copper Corrosion Test
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