ALPHA® OM234HF is a lead-free, no-clean solder paste designed for fine feature applications like flip chip LED interconnects. ALPHA® OM234HF is designed to enable the use of ALPHA® SAC305 alloy with Type 6 solder powder. ALPHA® OM234HF flux system has long work life and is suitable for applications that require reproducible solder transfer by pin transfer over several hours.

Features & Benefits

  • Excellent coalescence for fine and ultra fine feature deposits
  • Good void performance 
  • Pin transferable 
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