ALPHA® EF-2202

No-clean, water soluble, Low VOC, halogen-free

ALPHA® EF-2202, is a VOC-free, halide-free, rosin/resin-free, low solids no-clean flux which provides the highest activity of any VOC-free Bellcore compliant flux for defect-free soldering.  It is formulated with a proprietary mixture of organic activators which deliver excellent wetting and top-side hole fill, even with OSP coated bare copper boards which have undergone prior thermal excursions.  Several proprietary additives are also formulated into ALPHA EF-2202 which act to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solderball generation.  The formulation of ALPHA EF-2202 is also designed to be more thermally stable; thereby, reducing the occurrence of solder bridging.

Features & Benefits

  • Bellcore compliant for assemblies requiring this standard.
  • VOC-free to help meet air quality regulations.
  • Exceptional wetting for excellent hole-fill even with OSP coated bare copper boards, with prior reflows.
  • Thermally stable activators provide low solder bridging.
  • Reduces the surface tension between solder mask and solder to provide low solderball frequency.
  • Suitable for selective soldering process.
  • Very low level non-tacky residue to reduce interference with pin testing and good board cosmetics.


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