ALPHA® EF-2210

No-clean, water soluble, Low VOC, halogen-free

ALPHA® EF-2210 is VOC-free, halide-free, rosin/resin-free, low solids no-clean flux which provides the highest activity of any VOC-free Bellcore SIR compliant flux for defect-free soldering. It is formulated with a proprietary mixture of organic activators which deliver excellent wetting and top-side hole fill, even with OSP coated bare copper boards which have undergone prior thermal excursions. Several proprietary additives are also formulated into EF-2210 which act to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solderball generation. The formulation of EF-2210 is also designed to be more thermally stable; thereby, reducing the occurrence of solder bridging.

Features & Benefits

  • Bellcore SIR compliant for assemblies requiring this standard.
  • VOC-Free to help meet air quality regulations.
  • Exceptional wetting for excellent hole-fill even with OSP coated bare copper boards, with prior reflows.
  • Thermally stable activators provide low solder bridging. 
  • Reduces the surface tension between solder mask and solder to provide low solderball frequency.
  • Suitable for selective soldering process.
  • Excellent cosmetics. Very low level non-tacky residue to reduce interference with pin testing and good board cosmetics.
  • Performs well in either tin lead or lead-free processes.

Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.

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