Wave Solder Flux

ALPHA® NR-330, formerly development #9225, is a VOC-free, halide-free, rosin/resin-free, low solids, no-clean flux. It is formulated with a proprietary mixture of organic activators which deliver excellent wetting and top-side hole fill particularly to bare copper with OSP’s. Several proprietary additives are also formulated into NR-330 which act to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solderball generation. The formulation of NR-330 is also designed to be more thermally stable; thereby, reducing the occurrence of solder bridging.

Features & Benefits

  • Bellcore compliant for assemblies requiring this standard.
  • VOC-free to help meet air quality regulations. 
  • Exceptional wetting for excellent hole-fill even with organically coated bare copper boards, with prior reflows. 
  • Thermally stable activators provide low solder bridging.
  • Reduces the surface tension between solder mask and solder to provide low solderball frequency.
  • Very low level of non-tacky residue to reduce interference with pin testing and good board cosmetics.
  • Suitable for use with lead-free alloys such as 99.3Sn/0.7Cu and 96.5Sn/3.5Ag.

Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.

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