Wave Solder Flux

ALPHA® SLS-65C was specifically developed to eliminate the tendency for solder balling and solder bridging-two defects which are normally associated with the use of the chip wave. Of all low solids (< 4% solids), no-clean fluxes, SLS-65C exhibits the lowest tendency for solder ball generation over a wide variety of solder masks. SLS-65C should be considered for use by any assembler who has board designs which are sensitive to solder bridging, performs pin testing, and whose specification requires an extremely low frequency of solder balls.

ALPHA SLS-65C is an active, low solids, no-clean flux. It is formulated with a proprietary mixture of organic activators. Several proprietary additives are formulated into SLS-65C which act to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solder ball generation. The formulation of SLS-65C is also designed to be more thermally stable; thereby, reducing the occurrence of solder bridging.

Features & Benefits

  • Thermally stable activators provide the lowest solder bridging in a low solids, no-clean flux.
  • Reduces the surface tension between solder mask and solder to provide the lowest solder ball frequency of any low solids, no-clean flux.
  • Very low level of non-tacky residue to reduce interference with pin testing and exhibit no visible residue. 
  • Cleaning is not required which reduces operating costs.
  • Bellcore Compliant for long term electrical reliability.

Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.

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